XL1507-5.0E1 Performance Technical Deep Dive

^{September 8, 2025 News — With the acceleration of Industry 4.0 and automotive intelligence, the demand for high-efficiency power management chips continues to rise. The XL1507-5.0E1 high-voltage buck DC-DC converter is becoming an industry focus due to its exceptional power conversion performance. The chip delivers a continuous output current of 2A, supports a wide input voltage range of 4.5V to 40V, and provides a stable and precise 5.0V output, making it perfectly suited for various demanding application environments.}

^{With a conversion efficiency of up to 92% and an ultra-simple design requiring only five external components, it significantly enhances the reliability and power density of power systems. This provides robust hardware support for innovative applications in industrial control, consumer electronics, automotive electronics, and other fields.}

^{The XL1507-5.0E1 is a cost-effective, high-voltage step-down DC-DC converter (Buck Converter) introduced by the Chinese chip design company XLSemi (Xinlong Semiconductor). It converts a wide input voltage range into a stable fixed 5.0V output, capable of delivering up to 2A of continuous load current. The chip integrates a low on-resistance power MOSFET internally, significantly simplifying external circuit design, making it an efficient alternative to traditional linear regulators (such as the 7805).}

^{Wide Input Voltage Range: 4.5V to 40V, capable of withstanding load dump surges in automotive environments. Suitable for industrial, automotive, and communication applications with complex power conditions.}

^{1.Fixed Output Voltage: 5.0V (±2% accuracy).}

^{2.High Output Current: Supports up to 2A continuous output current.}

^{3.High Conversion Efficiency: Up to 92% (depending on input/output voltage conditions), significantly higher than linear regulators with reduced heat generation.}

^{4.Built-in Power MOSFET: Eliminates the need for an external switch, reducing system cost and PCB area.}

^{5.Fixed 150kHz Switching Frequency: Balances efficiency while minimizing the size of external inductors and capacitors.}

^{6.Comprehensive Protection Features:}

^{Cycle-by-cycle current limiting}

^{Thermal shutdown protection}

^{Output short-circuit protection (SCP)}

^{7.Eco-Friendly Package: Standard TO-252-2L (DPAK) package, compliant with RoHS standards and lead-free.}

^{This circuit employs a classic buck switching power supply topology, with the core objective of efficiently and stably converting a 12V input voltage to a 5V output voltage while delivering a maximum load current of 3A.}

^{1.Core Working Principle}

^{1.Switching Stage (ON State):
The high-voltage power MOSFET switch inside the XL1507 turns ON, applying the input voltage VIN (12V) to the power inductor (L1) and output capacitor (C2) through the chip's SW pin. The current path during this phase is: VIN → XL1507 → SW → L1 → C2 & Load.}

^{The current through inductor (L1) increases linearly, storing electrical energy in the form of a magnetic field.}

^{The output capacitor (C2) is charged, supplying power to the load and maintaining a stable output voltage.}

^{2.OFF State:
The internal MOSFET of the XL1507 turns OFF. Since inductor current cannot change abruptly, the inductor (L1) generates a back EMF (lower terminal positive, upper terminal negative).}

^{At this time, the freewheeling diode (D1) becomes forward-biased and conducts, providing a continuous path for the inductor current.}

^{The current path is: GND → D1 → L1 → C2 & Load.}

^{The energy stored in the inductor is released to the load and capacitor through the diode.}

^{3.Cycling and Regulation:
The XL1507 switches its internal MOSFET at a fixed frequency (~150 kHz). The PWM controller dynamically adjusts the duty cycle (i.e., the proportion of time the switch is ON within one cycle) to stabilize the output voltage. For example, to achieve 12V to 5V conversion, the ideal duty cycle is approximately 5V/12V ≈ 42%.}

2.Key Component Functional Analysis

^{3.Design Advantages Summary}

^{This typical circuit fully demonstrates the advantages of the XL1507-5.0E1:}

^{1.Minimalist Design: Thanks to the internally integrated MOSFET and fixed feedback, only 1 inductor, 1 diode, and 2 capacitors are required to build a complete power supply, resulting in extremely low BOM cost.}

^{2.High Efficiency: The switching mode operation and use of a Schottky diode achieve an efficiency (estimated >90%) far higher than linear regulator solutions (e.g., LM7805, with only ~40% efficiency and significant heat generation).}

^{3.High Reliability: Built-in overcurrent protection, thermal shutdown, and other features ensure the chip and downstream loads are protected under abnormal conditions.}

^{4.Compact Size: The high switching frequency allows the use of smaller inductors and capacitors, facilitating device miniaturization.}

^{5.This circuit is an ideal solution for automotive devices, routers, industrial controllers, and other applications that require efficient 5V/3A power conversion from a 12V source.}

^{A functional block diagram serves as a "map" to understand the chip. The core of the XL1507 is a current-mode PWM controller integrated with a power switch. Its internal workflow can be broken down into the following key components:}

^{1. Power & Reference}

^{2.Voltage Feedback Loop - "Setting the Target"}

^{3.Oscillation & Modulation - "Keeping the Rhythm"}

^{4.Power Switch & Drive - "The Executor"}

^{5.Current Sense & Protection - "Safety Assurance"}

^{Workflow Summary}

^{1.Power-On: VIN supplies power, generating an internal 5V reference and oscillation signal.}

^{2.Sampling & Comparison: The internal feedback network samples the fixed 5V output, and the error amplifier outputs the COMP voltage.}

^{3.Turn-On: When the oscillator clock signal arrives, the drive circuit activates the internal MOSFET, and the current begins to rise.}

^{4.Modulated Turn-Off: The current sense circuit monitors in real time. When the current value reaches the threshold set by the COMP voltage, the PWM comparator triggers and immediately turns off the MOSFET.}

^{5.Freewheeling & Filtering: During the off period, the external Schottky diode (D) provides a path for the inductor current, and the LC circuit filters the square wave into a smooth 5V DC output.}

^{6.Cycling & Protection: The next clock cycle begins, repeating steps 3-5. Protection circuits monitor throughout the process to ensure system safety.}

^{This sophisticated closed-loop system ensures that the XL1507-5.0E1 efficiently and reliably converts a fluctuating wide input voltage into a stable and clean 5V output voltage.}

^{The device incorporates multiple protection features, including:}

• ^{Cycle-by-cycle current limiting}
• ^{Automatic thermal shutdown protection}
• ^{Enhanced short-circuit protection}
• ^{These protection mechanisms ensure stable and reliable operation of the power system even under the most demanding electrical conditions.}

Key Points for Circuit Testing

^{1.Core Test Points}

^{VIN & GND: Measure input voltage and ripple.}

^{SW (Switch Node): Observe switching waveform, frequency, and ringing (Warning: Use probe ground spring during measurement).}

^{VOUT & GND: Measure output voltage accuracy, load regulation, and output ripple.}

^{2.Performance Tests}

^{Load Regulation: Fix input voltage, vary load current (0A → 3A), and monitor output voltage variation range.}

^{Line Regulation: Fix load current, vary input voltage (e.g., 10V → 15V), and monitor output voltage variation range.}

^{Ripple Measurement: Use an oscilloscope with ground spring attachment for accurate measurement at the VOUT point.}

^{3.Key Observations}

^{Waveform: The SW point waveform should be clean without overshoot or abnormal ringing.}

^{Stability: Output voltage should remain stable under all test conditions without oscillation.}

^{Temperature: Chip and inductor temperature rise should be within reasonable limits during full-load operation.}

^{PCB Layout Core Guidelines}

^{Rule 1: Minimize High-Frequency Loops}

^{Objective: Place the input capacitor (C_IN) as close as possible to the chip's VIN and GND pins.}

^{Reason: Shorten the high-frequency, high-current charge/discharge path. This is the most critical measure to suppress EMI radiation and reduce voltage spikes.}

^{Rule 2: Isolate Sensitive Feedback Paths}

^{Objective: Keep feedback traces away from the inductor (L1) and switch node (SW).}

^{Reason: Prevent magnetic and electric field coupling noise from entering the sensitive feedback network, avoiding output voltage instability or increased ripple.}

^{Rule 3: Optimized Grounding Strategy}

^{Objective: Use star grounding or single-point grounding. Connect the power ground (C_IN, D1, C_OUT) and signal ground (FB feedback) at a single point.}

^{Reason: Prevent voltage drops caused by high currents on the ground plane from interfering with the chip's reference ground, ensuring control loop stability.}

^{Rule 4: Optimize the Switch Node}

^{Objective: Keep the SW node trace short and wide.}

^{Reason: SW is a high-frequency voltage transition point. A compact layout reduces noise emission.}

^{Rule 5: Provide Thermal Dissipation Paths}

^{Objective: Place multiple ground vias under the chip's GND pins and the diode.}

^{Reason: Utilize the PCB's bottom copper layer to dissipate heat from power components, improving system reliability.}

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